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 TENTATIVE
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62777FNG
TB62777FNG
8-Channel Constant-Current LED Driver of the 3.3-V and 5-V Power Supply Voltage Operation
The TB62777FNG is comprised of constant-current drivers designed for LEDs and LED panel displays. The regulated current sources are designed to provide a constant current, which is adjustable through one external resistor. The TB62777FNG incorporates eight channels of shift registers, latches, AND gates and constant-current outputs. Fabricated using the Bi-CMOS process, the TB62777FNG satisfies the system requirement of high-speed data transmission. The TB62777FNG is RoHS.
Weight: 0.07 g (typ.)
Features
* * * * * * * * * * * * * Power supply voltages: VDD = 3.3 V/5 V Output drive capability and output count: 50 mA x 8 channels Constant-current output range: 5 to 40 mA Voltage applied to constant-current output terminals: 0.4 V (IOUT = 5 to 40 mA) Designed for common-anode LEDs Thermal shutdown (TSD) MIN:150 Power on reset (POR) Input signal voltage level: 3.3-V and 5-V CMOS interfaces (Schmitt trigger input) Maximum output voltage: 25V Serial data transfer rate: 25 MHz (max) @cascade connection Operating temperature range: Topr = -40 to 85C Package: SSOP-P-225-0.65B Constant-current accuracy
Output Voltage 0.4 V to 4 V Current accuracy Between Channels 3% Current Accuracy Between ICs 6% Output Current 15 mA
1
(Ver.0.2) 2008-1-23
TENTATIVE
Pin Assignment (top view)
GND SERIAL-IN CLOCK LATCH OUT0 OUT1 OUT2 OUT3 VDD R-EXT SERIAL-OUT ENABLE OUT7 OUT6 OUT5 OUT4
TB62777FNG
Block Diagram
OUT0
OUT1
OUT7
R-EXT
I-REG
TSD
VDD
POR ENABLE Q ST R D
LATCH
Q ST R D
Q ST R D
GND
SERIAL-IN
D0
Q0
Q1 Q7 8-bit shift register D0 to D7
R
CLOCK SERIAL-OUT
D
Q
CK R
Truth Table
CLOCK
LATCH
ENABLE
SERIAL-IN
OUT0 ... OUT5 ... OUT7 Dn ... Dn - 5 ... Dn - 7 No Change Dn + 2 ... Dn - 3 ... Dn - 5 OFF OFF
SERIAL-OUT No change No change No change No change Dn 4
H L H X X
L L L H H
Dn Dn + 1 Dn + 2 Dn + 3 Dn + 3
Note 1:
OUT0 to OUT7 = On when Dn = H; OUT0 to OUT7 = Off when Dn = L.
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(Ver.0.2) 2008-1-23
TENTATIVE
Timing Diagram
n=0 CLOCK 1 2 3 4 5 6 7
TB62777FNG
H L H
SERIAL-IN
L H LATCH L H ENABLE L ON
OUT0
OFF ON
OUT1
OFF ON OUT2 OFF
ON
OUT7
OFF H SERIAL-OUT
Data applied when n = 0
L
Note 1: Latches are level-sensitive, not edge-triggered. Note 2: The TB62777FNG can be used at 3.3 V or 5.0 V. However, the VDD supply voltage must be equal to the input voltage. Note 3: Serial data is shifted out of SERIAL-OUT on the falling edge of CLOCK. Note 4: The latches hold data while the LATCH terminal is held Low. When the LATCH terminal is High, the latches do not hold data and pass it transparently. When the ENABLE terminal is Low, OUT0 to OUT7 toggle between ON and OFF according to the data. When the ENABLE terminal is High, OUT0 to OUT7 are forced OFF.
3
(Ver.0.2) 2008-1-23
TENTATIVE
Terminal Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin Name GND SERIAL-IN CLOCK
LATCH
TB62777FNG
Function GND terminal Serial data input terminal Serial clock input terminal Latch input terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Constant-current output terminal Output enable input terminal
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
ENABLE SERIAL-OUT R-EXT VDD
All outputs ( OUT0 to OUT7 ) are disabled when the ENABLE terminal is driven High, and enabled when it is driven Low. Serial data output terminal. Serial data is clocked out on the falling edge of CLOCK. An external resistor is connected between this terminal and ground. OUT0 to OUT7 are adjusted to the same current value. Power supply terminal
Equivalent Circuits for Inputs and Outputs
CLOCK, SERIAL-IN
VDD CLOCK SERIAL-IN ENABLE LATCH GND GND
ENABLE
LATCH
VDD
SERIAL-OUT
SERIAL-OUT
OUT0 ~ OUT7
OUT0 ~ OUT7
GND
4
(Ver.0.2) 2008-1-23
TENTATIVE
Absolute Maximum Ratings (Ta = 25C)
Characteristics Supply voltage Input voltage Output current Output voltage Power dissipation Thermal resistance Operating temperature range Storage temperature range Maximum junction temperature Symbol VDD VIN IOUT VOUT Pd Rth (j-a) Topr Tstg Tj Rating 6.0
-0.3 to VDD + 0.3 (Note 1)
TB62777FNG
Unit V V mA/ch V W C/W C C C
55 0.3 to 25 1.02 (Notes 2 and 3) 122
-40 to 85 -55 to 150
(Note 2)
150
Note 1: However, do not exceed 6.0 V. Note 2: When mounted on a PCB (76.2 x 114.3 x 1.6 mm; Cu = 30%; 35-m-thick; SEMI-compliant) Note 3: Power dissipation is reduced by 1/Rth (j-a) for each C above 25C ambient.
Operating Ranges (unless otherwise specified, Ta = -40C to 85C)
Characteristics Supply voltage Output voltage Symbol VDD VOUT IOUT Output current IOH IOL VIH Input voltage VIL Clock frequency
LATCH pulse width
Test Condition
Min 3 0.4 5

Typ.

Max 5.5 4 40
-5
Unit V V mA/ch mA
OUT0 to OUT 7 OUT0 to OUT 7 SERIAL-OUT SERIAL-OUT SERIAL-IN/CLOCK/ LATCH / ENABLE Cascade connection (Note 2) (Note 2) IOUT 20 mA 5 mA IOUT 20 mA (Note 2) (Note 2)
5 VDD 0.3 x VDD 25

0.7 x VDD GND
V
fCLK twLAT twCLK twENA tSETUP1 tSETUP2
MHz ns
20 20 2 3 5 5
CLOCK pulse width ENABLE pulse width
s
Setup time
(Note 2) 5 5
ns
Hold time Maximum clock rise time Maximum clock fall time
tHOLD1 tHOLD2 tr tf Single operation (Notes 1 and 2)
5 5
s
Note 1: For cascade operation, the CLOCK waveform might become ambiguous, causing the tr and tf values to be large. Then it may not be possible to meet the timing requirement for data transfer. Please consider the timing carefully. Note 2: Please see the timing waveform on page 10.
5
(Ver.0.2) 2008-1-23
TENTATIVE
TB62777FNG
Electrical Characteristics (Unless otherwise specified, Ta = 25C, VDD = 4.5 to 5.5 V)
Characteristics Output current Output current error between ICs Output current error between channels Output leakage current Symbol IOUT1
IOUT1 IOUT2
Test Circuit 5 5 5 5

Test Condition VOUT = 0.4 V, R-EXT = 1.2 k VDD = 5 V, VOUT = 0.4 V, R-EXT = 1.2 k All channels ON VDD = 5 V, VOUT = 0.4 V, R-EXT = 1.2 k All channels ON VDD = 5 V, VOUT = 25 V SERIAL-IN/CLOCK/ LATCH / ENABLE SERIAL-IN/CLOCK/ LATCH / ENABLE VIN = VDD CLOCK/SERIAL-IN / LATCH / ENABLE VIN = GND CLOCK/SERIAL-IN/ LATCH / ENABLE
Min
Typ. 15
3
Max
Unit mA
6 3

1
%
A
IOZ VIH
1 VDD
0.7 x VDD GND
Input voltage VIL IIH Input current IIL 3 0.3 x VDD 1
V
2
A -1
VOL SERIAL-OUT output voltage VOH Changes in constant output current dependent on VDD %/VDD IDD (OFF) 1 Supply current IDD (OFF) 2 IDD (ON)
1 1 5 4 4 4
IOL = 5.0 mA, VDD = 5 V IOH = -5.0 mA, VDD = 5 V VDD = 3 V to 5.5 V R-EXT = OPEN, VOUT = 25.0 V R-EXT = 1.2 k, VOUT = 25.0 V, All channels OFF R-EXT = 1.2 k, VOUT = 0.4 V, All channels ON
0.3 V
4.7

1

2 1 5 9
%
mA
Switching Characteristics (Unless otherwise specified, Ta = 25C, VDD = 4.5 to 5.5V)
Characteristics Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL Output rise time Output fall time tor tof Test Circuit 6 Test Condition (Note 1) Min

Typ. 20
Max 300
Unit
CLK- OUTn , LATCH = "H", ENABLE = "L" LATCH - OUTn , ENABLE = "L" ENABLE - OUTn , LATCH = "H" CLK-SERIAL OUT CLK- OUTn , LATCH = "H", ENABLE = "L" LATCH - OUTn , ENABLE = "L" ENABLE - OUTn , LATCH = "H" CLK-SERIAL OUT 10% to 90% points of OUT0 to OUT7 voltage waveforms 90% to 10% points of OUT0 to OUT7 voltage waveforms
6
20
300
6 6 6
20 10 30
300 14 340 ns
Propagation delay time
2

6
70
340
6 6 6 6
70 10 20 125.
340 14 150 300
2
Note 1: Topr = 25C, VDD = VIH = 5 V, VIL = 0 V, REXT = 1.2 k, IOUT = 15mA, VL = 5.0 V, CL = 10.5pF (see test circuit 6.)
6
(Ver.0.2) 2008-1-23
TENTATIVE
TB62777FNG
Electrical Characteristics (Unless otherwise specified, Ta = 25C, VDD = 3 to 3.6 V)
Characteristics Output current Output current error between ICs Output current error between channels Output leakage current Symbol IOUT1
IOUT1 IOUT2
Test Circuit
Test Condition VOUT = 0.4 V, R-EXT = 1.2 k VDD = 3.3 V, VOUT = 0.4 V, R-EXT = 1.2 k All channels ON VDD = 3.3 V, VOUT = 0.4 V, R-EXT = 1.2 k All channels ON VDD = 3.3 V, VOUT = 25 V SERIAL-IN/CLOCK/ LATCH / ENABLE SERIAL-IN/CLOCK/ LATCH / ENABLE VIN = VDD CLOCK/SERIAL-IN/ LATCH / ENABLE VIN = GND CLOCK/SERIAL-IN/ LATCH / ENABLE
Min
Typ. 15
3
Max
Unit mA
5 5 5 5 2
6 3
% %
A

1
IOZ VIH
1 VDD
0.7 x VDD GND
Input voltage VIL 0.3 x VDD 1
V
IIH Input current IIL
A -1
3 1 1 5 4 4 4
VOL SERIAL-OUT output voltage VOH Changes in constant output current dependent on VDD %/VDD IDD (OFF) 1 Supply current IDD (OFF) 2 IDD (ON)
IOL = 5.0 mA, VDD = 3.3 V IOH = -5.0 mA, VDD = 3.3 V VDD = 3 V to 5.5 V R-EXT = OPEN, VOUT = 25.0 V R-EXT = 1.2 k, VOUT = 25.0 V, All channels OFF R-EXT = 1.2 k, VOUT = 0.4 V, All channels ON
0.3 V
3.0

1

2 1 5 9
%
mA
Switching Characteristics (Unless otherwise specified, Ta = 25C, VDD = 3 to 3.6 V)
Characteristics Symbol tpLH1 tpLH2 tpLH3 tpLH tpHL1 tpHL2 tpHL3 tpHL Output rise time Output fall time tor tof Test Circuit Test Condition (Note 1) Min

Typ.

Max 300
Unit
6 6 6 6 6 6 6 6 6 6
CLK- OUTn , LATCH = "H", ENABLE = "L" LATCH - OUTn , ENABLE = "L" ENABLE - OUTn , LATCH = "H" CLK-SERIAL OUT CLK- OUTn , LATCH = "H", ENABLE = "L" LATCH - OUTn , ENABLE = "L" ENABLE - OUTn , LATCH = "H" CLK-SERIAL OUT 10% to 90% points of OUT0 to OUT7 voltage waveforms 90% to 10% points of OUT0 to OUT7 voltage waveforms
300
300 14 340 ns
Propagation delay time
2

340
340 14 150 300
2

Note 1: Topr = 25C, VDD = VIH = 3.3 V, VIL = 0 V, REXT = 1.2 k, IOUT = 15mA, VL = 5.0 V, CL = 10.5pF (see test circuit 6.)
7
(Ver.0.2) 2008-1-23
TENTATIVE
Test Circuits
Test Circuit 1: SERIAL-OUT output voltage (VOH/VOL)
VDD
TB62777FNG
ENABLE F.G CLOCK
LATCH
OUT0
SERIAL-IN
OUT7
IO = -5 mA to 5 mA
CL = 10.5 pF
V
Test Circuit 2: Input Current (IIH)
VIN = VDD VDD
A A A
ENABLE CLOCK
LATCH
OUT0
A
SERIAL-IN
OUT7
3 to 3.6V
Test Circuit 3: Input Current (IIL)
A A A A
ENABLE CLOCK LATCH SERIAL-IN VDD
OUT0
OUT7
3 to 3.6V
R-EXT
GND
SERIAL-OUT
CL = 10.5 pF
8
(Ver.0.2) 2008-1-23
VDD = 4.5 to 5.5 V
REXT
VDD = 4.5 to 5.5 V
R-EXT
GND
SERIAL-OUT
CL = 10.5 pF
REXT
VDD = 5 V
REXT
VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%)
3.3V
R-EXT
GND
SERIAL-OUT
TENTATIVE
Test Circuit 4: Supply Current
TB62777FNG
ENABLE F.G CLOCK
LATCH
OUT0
SERIAL-IN
OUT7
3 to 3.6V
R-EXT
REXT = 1.2 k
Test Circuit 5: Output Current (IOUT1), Output Leakage Current (IOZ) Output Current Error Margin (IOUT1/IOUT2), Current Variation with VDD (%/VDD)
ENABLE CLOCK F.G
LATCH
VDD
CL = 10.5 pF
OUT0
A
SERIAL-IN
OUT7
A
3 to 3.6V VOUT = 0.4 V, 25 V
A
VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) R-EXT
REXT = 1.2 k
Theoretical output current = 1.13 V/REXT x 16
Test Circuit 6: Switching Characteristics
ENABLE CLOCK F.G LATCH SERIAL-IN OUT7 CL = 10.5 pF VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%) R-EXT
REXT = 12 k 3 to 3.6V
VDD
RL=300 OUT0 CL IOUT
9
(Ver.0.2) 2008-1-23
VDD = 4.5 to 5.5 V
GND
SERIAL-OUT
CL = 10.5 pF
VL = 5 V
VDD = 4.5 to 5.5 V
GND
SERIAL-OUT
CL = 10.5 pF
VDD = 4.5 to 5.5 V
VIH = VDD VIL = 0 V tr = tf = 10 ns (10 to 90%)
A
GND
SERIAL-OUT
TENTATIVE
Timing Waveforms
1. CLOCK, SERIAL-IN, SERIAL-OUT
twCLK CLOCK 50% tSETUP1 SERIAL-IN 50% tHOLD1 SERIAL-OUT 50% tpLH/tpHL 50% 50% 90% 10% tr tf 90% 10%
TB62777FNG
2. CLOCK, SERIAL-IN, LATCH , ENABLE , OUTn
CLOCK 50% 50%
SERIAL-IN tHOLD2 LATCH 50% twLAT ENABLE 50% tSETUP2 50% twENA twENA 50% 50%
OUTn
tpHL1/LH1 tpHL2/LH2
50%
50%
tpHL3/LH3
3. OUTn
90% 90% OFF
OUTn
10% tof 10% tor ON
10
(Ver.0.2) 2008-1-23
TENTATIVE
TB62777FNG
PCB Conditions: 76.2 x 114.3 x 1.6 mm, Cu = 30%, 35-m Thick, SEMI-Compliant
IOUT - Duty ON PCB 100 90 80 70
IOUT (mA)
Pd-Ta 1.4 1.2 1.0
Pd(W)
60 50 40 30 20 10 0 0 20 40 60 80 100 Duty - Turn-ON rate (%)
ON PCB All outputs ON Ta = 85C VDD = 5.0 V VOUT = 1.0 V
0.8 0.6 0.4 0.2 0.0 0 50 Ta (C) 100 150
Output Current vs. External Resistor (typ.)
50 45 40 35
IOUT (mA)
IOUT - REXT IOUT - REXT
IOUT (mA)
30 25 20 15 10 5 0 100 1000 REXT () 10000
All outputs ON Ta = 25C VOUT = 0.7 V
The above graphs are presented merely as a guide and does not constitute any guarantee as to the performance or characteristics of the device. Each product design should be fully evaluated in the real-world environment.
11
(Ver.0.2) 2008-1-23
TENTATIVE
Application Circuit: General Composition for Static Lighting of LEDs
In the following diagram, it is recommended that the LED supply voltage (VLED) be equal to or greater than the sum of Vf (max) of all LEDs plus 0.7 V.
TB62777FNG
VLED
O0
SERIAL-IN C.U. ENABLE LATCH CLOCK
O1
O2
O5
O6
O7
SERIAL-OUT SERIAL-IN ENABLE LATCH CLOCK
O0
O1
O2
O5
O6
O7
SERIAL-OUT
TB62777FNG
R-EXT GND
TB62777FNG
R-EXT GND
12
(Ver.0.2) 2008-1-23
TENTATIVE
Application Circuit: General Composition for Dynamic Lighting of LEDs
In the following diagram, it is recommended that the LED supply voltage (VLED) be equal to or greater than the sum of Vf (max) of all LEDs plus 0.7 V.
TB62777FNG
Example) TD62M8600FG 8 bit multichip PNP transistor array. It is not necessary when lighting statically.
VLED
O0
SERIAL-IN C.U. ENABLE LATCH CLOCK
O1
O6
O7
SERIAL-OUT SERIAL-IN ENABLE LATCH CLOCK
O0
O1
O6
O7
SERIAL-OUT
TB62777FNG
R-EXT GND
TB62777FNG
R-EXT GND
13
(Ver.0.2) 2008-1-23
TENTATIVE
Package Dimensions
TB62777FNG
Weight: 0.07 g (typ.)
14
(Ver.0.2) 2008-1-23
TENTATIVE
Notes on Contents
1. Block Diagrams
TB62777FNG
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
(2)
(3)
(4)
15
(Ver.0.2) 2008-1-23
TENTATIVE
(5)
TB62777FNG
Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
(1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
16
(Ver.0.2) 2008-1-23
TENTATIVE
TB62777FNG
About solderability, following conditions were confirmed
* Solderability
(1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
17
(Ver.0.2) 2008-1-23


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